Second, the major technical indicators. Max size: single-sided, double-sided: 600mm * 500mm MLB: 400mm * 600mm 2. Processing Thickness: 0.2mm -4.0mm 3. Copper substrate thickness: 18μ (1 / 2OZ), 35μ (1OZ), 70μ (2OZ) 4. Common substrates: FR-4, CEM-3, CEM-1, poly vinyl chloride, FR-1 (94V0,94HB) 5. Light copper, nickel, gold, tin spray; Immersion Gold, antioxidant, HASL, immersion tin and so on. Three. Process capability: (1) Drilling: smallest aperture 0.2MM (2) hole metal: the smallest aperture 0.3mm, thickness / aperture ratio of 4: 1 (3) wire width: Minimum width: gold plate 0.10mm, tin plate 0.15mm (4) wire spacing: Minimum spacing: gold plate 0.10mm, tin plate 0.15mm (5) gold plate: nickel layer thickness:> or = 2.5μ gold layer thickness: 0.05-0.1μm or according to customer requirements (6) HASL: tin layer thickness:> or = 2.5-5μ (7) paneling: Wire-to-edge minimum distance: 0.15mm minimum distance to the edge of the hole: 0.15mm smallest form tolerance: ± 0.1mm (8) socket chamfer: angle: 30 degrees, 45 degrees, 60 degrees Depth: 1 -3mm (9) V cut: angle: 30 degrees, 35 degrees, 45 degrees Depth: 2/3 thickness Minimum size: 80mm * 80mm